Developing reliable metallization systems for ceramics including aluminum nitride requires ongoing materials research. Sienna Technologies, Inc., has made substantial efforts under both in-house and government funded programs and made significant advances in developing high performance metallization and brazing technologies for Sienna’s ST-family of aluminum nitride, alumina, silicon nitride, and silicon carbide. Aluminum nitride can be metallized through current thin and thick film metallization technologies.

Sienna-ACPD offers Refractory Molybdenum – ManganeseThick Film Conductor Gold and Platinum, Thick Film Copper, Thick Film Silver, Thick Film Silver/Platinum, Thick Film Dielectric, Thick Film Resistor metallizations; Glass Sealing; Hermetic Brazing; and Active Metal Brazing for aluminum nitride and aluminum oxide.

Sienna-ACPD also offers a variety of robust Thick Film Metallizations; Thick Film Dielectric; Glass Sealing, and Active Metal Brazing for silicon nitride. Our Thick Film Conductor Gold on silicon nitride has demonstrated excellent reliability over a wide temperature range from -180°C to +125°C.

Sienna’s technical team is ready to help you implement aluminum nitride, silicon nitride, and alumina in your next generation of products. Contact us for applications assistance and fast prototyping.