Pressure Sensors

Sienna Technologies, Inc., in collaboration with NASA Glenn Research Center (NASA-GRC), has developed a robust high temperature MEMS pressure sensor complete with a micromachined sensor element, high temperature stable contact metallizations, and an aluminum nitride hermetic MEMS-DCA packaging.  A NASA-GRC developed accelerated-stress-testing protocol was used to screen and evaluate the reliability of packaged SiC pressure transducers that operated reliably at 600ºC over 100 hours.  Effort is currently underway to use this protocol to evaluate transducers 800ºC and beyond.