Sienna Technologies, Inc. is at the forefront of electronic package development for harsh environments, low and high temperature electronics. Sienna has developed a leadless robust packaging technology for use at high temperatures over 300°C up to 800°C and low temperatures down to – 180°C in harsh environments utilizing its unique materials expertise to metallize and seal aluminum nitride, alumina, and silicon nitride. In collaboration with NASA, Sienna Technologies successfully applied the leadless packaging technology to develop robust ceramic based single- and multi-chip modules for SiC devices and MEMS SiC pressure sensor packages for high temperature harsh environments, and silicon nitride ceramic based multi-chip modules for SiGe devices for low temperature (-180°C) electronics for demanding including aerospace applications.
Sienna Technologies, Inc. was formed with a mission... Delivering innovative solutions through advanced material's technologies.
Sienna Technologies is on the cutting edge of technology through advanced research and development
