Sienna Technologies, Inc., in collaboration with NASA Glenn Research Center (NASA-GRC), has developed a robust, hermetic, high temperature, aluminum nitride ceramic MEMS-DCA packaging. A NASA-GRC developed accelerated-stress-testing protocol was used to screen and evaluate the reliability of packaged SiC pressure transducers that operated reliably at 600ºC over 100 hours. Effort is currently underway to use this protocol to evaluate transducers 1000ºC and beyond.
Sienna Technologies, Inc. was formed with a mission... Delivering innovative solutions through advanced material's technologies.
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